Advisory Board

Winfred Chen

  • Midea Group
  • Chief Hardware Architect of AIoT, Home Service Robot, Intelligent Innovation Centre
  • Biography

Chen Yuanfeng graduated from Fudan University in 2006 with a Ph.D. in Microelectronics.

From 2006 to 2013, he worked for Samsung Semiconductor in South Korea and was involved in the design of several mobile CPU chips, including the world’s first large and small nuclear concept of mobile phone CPU. Before leaving office, he was the head of Samsung’s Greater China mobile phone chip FAE and provided technical services to four mobile phone companies in China Cool Union.

In May 2013, he returned to China to join Huawei Terminal Architecture Design Department, participated in the planning and research and development of Heath’s domestic chip Kirin930/950/970/980, and landed as a mobile phone product. During the terminal period, participated in the development of Heath’s first generation of independent ISPs, successful commercial. Later led Huawei’s mobile phone sensor subsysystor research and development team to overcome various sensors under the small size of commercial technology difficulties and innovations.
In August 2017, he joined OPPO as chief chip planner, leading OPPO’s chip planning, and also served as chip platform manager for OPPO R15 mobile phones, leading the R15 product team to a successful launch.

After joining Alibaba in April 2018 and participating in the acquisition of Zhongtian micro, IoT Hardware Lab was established as the chief hardware architect, groping out the hardware innovation model in the software company, launching Alibaba Cloud’s first innovative gateway and forming Ali Eco-Play.

In September 2020, he joined the Intelligent Innovation Center of the United States, responsible for the direction of home service robots.

Personal areas of expertise include: mobile phones, tablets, wearable devices and robot direction of professional system design, integrated circuit design optimization and selection has rich experience and solid foundation, with sensors, indoor and outdoor positioning navigation and computer vision processing basic theory and system optimization program experience, in the Internet of Things smart home, smart buildings, smart park, smart agriculture, smart industry, smart city has accumulated a lot of experience.

At present, in addition to his own work, he is also a special expert lecturer of Shanghai Pudong Smart Lighting Federation, an industrial planning consultant of Zhejiang Huzhou Municipal Government Integrated Circuit Industrial Park, and a special consultant of Pangu Venture Fund.

陈苑锋,2006年毕业于复旦大学微电子学专业,获理学博士学位。

2006年到2013年在韩国三星半导体就职,参与设计了多款手机CPU芯片,其中包括全球第一款大小核理念的手机CPU。离职前为三星大中华区手机芯片FAE负责人,为中华酷联四家手机公司提供技术服务。

2013年5月回国,加入华为终端架构设计部,参与了海思国产芯片Kirin930/950/970/980的规划和研发,并成攻落地为手机产品。在终端期间,参与了海思第一代自主ISP的研发,成功商用。后期带领华为手机传感器子系统的研发团队攻克小尺寸手机下的各种传感器商用技术难点和创新。

2017年8月以首席芯片规划师身份入职OPPO,主导OPPO的芯片规划,同时兼任OPPO R15手机的芯片平台经理,带领R15产品团队顺利落地上市。

2018年4月加入阿里巴巴,参与收购中天微后,建立了IoT硬件实验室,任首席硬件架构师,摸索出软件公司里的硬件创新模式,推出阿里云首个创新性网关,形成阿里生态打法。

2020年9月加入美的智能创新中心,负责家用服务机器人方向。

个人擅长的领域包含:手机、平板、穿戴式设备和机器人方向的专业系统设计;对集成电路的设计优化及选型具有丰富经验和坚实基础;具备传感器、室内外定位导航和计算机视觉处理的基础理论及拥有系统优化方案的丰富经验;在物联网的智慧家居、智慧楼宇、智慧园区、智慧农业、智慧工业、智慧城市积累了大量的经验。

当前除本职工作外,兼任上海浦东智慧照明联合会特聘专家讲师、浙江湖州市政府集成电路产业园产业规划顾问、盘古创业基金特聘顾问。