MWS EU 2021 Speaker
Dr. Roland Helm
Dr. Roland Helm joined Infineon in 2003 after working in a technology start-up and in a business consultancy. Since 2006 he is responsible for the MEMS Microphone business. He has been growing the business from technical feasibility to relevant market share by focusing on customer requirements, leading performance MEMS and ASIC designs as well as high volume manufacturing and delivery capability. He is passionate to match new technology to the needs of modern society.
Roland has a Ph. D. from Technical University of Munich where he majored in physics.
High-Performance XENSIV™ MEMS Microphones – Pushing the Boundaries of Audio
Infineon XENSIV sensor portfolio emulates the human senses of feeling, seeing, smelling and hearing. Particularly, MEMS microphones are gaining market traction worldwide.
Continuous MEMS technology innovation has been the key enabler for a new audio revolution. New audio features with excellent performance are brought to TWS headsets. Selfie videos, live videos, concerts, meetings, and memos – novel information and experience sharing will be possible with high-definition audio quality in the phone. Excellent MEMS microphones turn laptops into communication systems, enhancing the effectiveness of online meetings.
Localizing 3D positions through ultrasound for the precise 3D detection of objects in real-time is another innovative use case for Infineon’s high performance MEMS microphones.
Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer and greener. Barely visible, semiconductors have become an indispensable part of everyday life. Ranked one of the global top 10 semiconductor companies, we play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world.
Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analogue, and mixed-signal applications.
- Automotive: 32-bit automotive microcontrollers for powertrain, safety and driver assistance systems; 3D ToF sensors; discrete power semiconductors; IGBT modules; magnetic and pressure sensors; memories (NOR Flash, SRAM, nvSRAM, F-RAM); power ICs; radar sensor ICs (77 GHz); SiC diodes, SiC MOSFETs and SiC modules; transceivers (CAN, CAN FD, LIN, Ethernet, FlexRay™); voltage regulators
- Industrial Power Control: bare die business; discrete IGBTs; driver ICs; IGBT modules (low-power, medium-power, high-power); IGBT module solutions including IGBT stacks; intelligent IGBT modules with integrated control unit, driver and switch; SiC diodes, SiC MOSFETs, SiC modules
- Power & Sensor Systems: 3D ToF sensors; chips for gas sensors; chips for MEMS microphones; chips for pressure sensors; control ICs for power switches; customized chips (ASICs); discrete low-voltage, mid-voltage and high-voltage power MOSFETs (Si-based); GaN power switches; GPS low-noise amplifier; low-voltage and high-voltage driver ICs; radar sensor ICs (24 GHz, 60 GHz); RF antenna switches; RF power transistors; SiC diodes, SiC MOSFETs; TVS (transient voltage suppressor) diode; USB controller
- Connected Secure Systems: connectivity solutions (Wi-Fi, Bluetooth, BLE); embedded security controllers; microcontroller for consumer electronics and industrial applications; security controllers (contact-based, contactless, dual-interface)
Infineon Technologies AG
Am Campeon 1-15
85579 Neubiberg (near Munich), Germany
Tel: +49 89 234-0