MWS EU 2021 Speaker
Volker Herbig, VP BU MEMS at X-FAB, overseas all MEMS activities within the X-FAB Group. Before assuming his current role, Volker worked as Director Product Marketing at X-FAB. Previously he held also engineering, marketing and management positions at Siemens, Inkjet Technologies and Carl Zeiss where, among other activities, he developed MEMS inkjet print heads and was responsible for setting up a manufacturing facility for those. Volker Herbig holds a master’s degree in physics from Humboldt University, Berlin, Germany.
Trends in Wafer Level Integration & Packaging Technologies – Pushing the Envelope of Function, Performance and Efficiency to Enable Advanced System Solutions
Over the past years the semiconductor ecosystem has experienced an ever increasing demand in wafer level integration and packaging technologies, pushing the envelope of functionality, performance and efficiency. In this talk, we will present integration schemes for functional components – ASICs, Sensors and passive devices – and advanced materials, such as glass, polymers, noble metals or compound semiconductors, within a CMOS manufacturing environment. We will outline current technology trends within the MEMS foundry space for heterogonies and monolithic integration, discuss corresponding technology maturity levels while highlighting trade-offs and challenges of both existing and future solutions from an technology and business perspective.
X-FAB MEMS Foundry offers high-volume MEMS manufacturing service and draws on more than 25 years of MEMS manufacturing experience. Operating from five fabs for MEMS and CMOS processes, X-FAB is the proven choice for process development, process capability and long-term manufacturing stability. Along with customer specific process installation, X-FAB offers a range of qualified, in-production, open-platform processes and IP blocks for key MEMS device types.