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Permanent Room Temperature Wafer Bonding by Surface Activation
Alexander Spatzig, Business Development Manager Europe – Mitsubishi Heavy Industries Machine Tool
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Market Dynamics Driving NXP MEMS Solutions
Wayne Chavez, GM Pressure Sensors – NXP Semiconductors
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Trends Evolution and Impact on the MEMS Industry
Andrea Onetti, Analog, MEMS and Sensors Group Vice President MEMS Sensors Division General Manager – STMicroelectronics
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Cost Models for MEMS Product Development
Alissa Fitzgerald, CEO – AMFitzgerald
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Smart algorithms, embedded AI and MEMS sensors – the silent enablers of sophisticated daily-life use cases
Ralf Schellin, VP and Head of Product Area MEMS – Bosch Sensortec GmbH
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Ion Beam Etching, a flexible tool for MEMS manufacturing
Marcel Demmler, Sales Director – scia Systems GmbH
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Business Development Manager Europe, Mitsubishi Heavy Industries Machine Tool
Alexander Spatzig has studied Production and Engineering Management at Technical University Berlin and Sophia University, Tokyo. Since 2016 Mr. Spatzig is leading the business development and customer projects of Mitsubishi Heavy Industry Machine Tool in Europe.
Suppose that two wafers are rigidly and permanently bonded at room temperature….such a dreamy idea is realized by SAB (Surface Activated Bonding). SAB is originally developed in Japan and has been studied for a many years. Today SAB technology becomes widely applied to various field, with thanks to its simple process and high degree of freedom in materials selection.We will introduce Room Temperature Wafer Bonding by Surface Activation through explanation about the process principles, suitable materials and applications, as well as features and strengths of the technology.
Mitsubishi Heavy Industries Machine Tool (MAT) is part of MHI Group and focuses on the design, manufacturing, sales, product installation, technical guidance, after-sales and consulting services for machine tools for various industries from automobiles to robots and aerospace.
The company has been manufacturing machine tools since 1939. As one of Japan’s leading manufacturers of specialized and high-precision machine tools it has been developing and brought to market a mass production system for room temperature wafer bonder technology since more than ten years.
Company product and service Information
Suppose that two wafers are rigidly bonded at room temperature….such a dreamy idea is realized by SAB (Surface Activated Bonding). SAB is originally developed in Japan and has been studied for a many years. Today SAB technology becomes widely applied to various field, with thanks to its simple process and high degree of freedom in materials selection.
Our mission is to help customers in R&D and mass production of the device. BOND MEISTER is the wafer bonder worth the name of “MEISTER”, which integrated manufacturing technology and process technology that we have cultivated for many years. We will support our customers with reliable bonding machine and high quality bonding process service.
GM Pressure Sensors, NXP Semiconductors
Wayne Chavez is the Senior Director and General Manager of NXP’s Pressure Sensor Product Line as part of NXP’s Advanced Analog Business Line and has held this position since March 2020.
Wayne is a semiconductor industry veteran with over 30 years of industry experience across a broad array of product technologies, technical roles and business management roles. Since 2008, Wayne has been a leader within NXP’s MEMS sensor product organizations and was responsible for bringing to market NXP’s 1st altimeter, 1st 3 axis gyroscope, 1st 6 axis eCompass solution, and 1st 3 axis accelerometer with an integrated MCU. Since early 2020 Wayne has been focused on growing the MEMS pressure sensor business at NXP.
Following a brief NXP MEMS historical summary, market trends and dynamics shaping the future of NXP MEMS solutions will be discussed with emphasis on automotive applications.
NXP Semiconductors N.V. offers various semiconductor products. The company’s product portfolio includes microcontrollers; application processors including i.MX application processors and i.MX 8 family of applications processors ; communication processors; wireless connectivity solutions, such as Near Field Communications, Ultra-wideband, Bluetooth low-energy, Zigbee, and Wi-Fi and Wi-Fi/Bluetooth integrated SoCs; analog and interface devices; Radio Frequency power amplifiers; and security controllers, as well as semiconductor-based environmental and inertial sensors, including pressure, inertial, magnetic, and gyroscopic sensors. Its product solutions are used in a range of applications, including automotive, industrial and Internet of Things, mobile, and communication infrastructure. The company markets its products to various original equipment manufacturers, original design manufacturers, contract manufacturers, and distributors. It operates is China, the Netherlands, the United States, Singapore, Germany, Japan, South Korea, Malaysia, and internationally. The company was formerly known as KASLION Acquisition B.V and changed its name to NXP Semiconductors N.V. in May 2010. NXP Semiconductors N.V. was founded in 2006 and is headquartered in Eindhoven, the Netherlands.
Analog, MEMS and Sensors Group Vice President MEMS Sensors Division General Manager, STMicroelectronics
Andrea Onetti is Group Vice President in the Analog, MEMS and Sensors Group and General Manager of ST’s MEMS Sensors Division and has held this position since February 2016.
Onetti joined STMicroelectronics’ R&D Lab in Castelletto, Italy, in 1990, as a designer of mixed-signal audio IC’s and moved into Product Management five years later, in charge of Marketing for Consumer Audio. Under his leadership, his organization became a Product Division and Onetti’s scope was enlarged to include management of planning, operation,and quality of audio products. In 2011, ST created the Audio and Sound Business Unit, targeting the whole audio chain, from detectors (MEMS microphones) to transducers (MEMS speakers), under Onetti’s charge. Most recently, he added responsibility for the Analog and Audio Systems Division, including catalog analog standard products.
Onetti has several patents for analog circuit implementations in the Audio domain.
Andrea Onetti was born in Pavia, Italy, in 1965, and graduated with a Degree in Microelectronics from University of Pavia.
MEMS are a fundamental technology behind the sensors and actuators which play a crucial role in the interface between the real and digital worlds. They are a key contributor to enable strategic trends in the electronic industry such as smart mobility, power and energy management, and IoT & 5G. This presentation looks the current state of the MEMS industry and considers its evolution driven by these trends combined with the impact of current market dynamics.
At ST, we are 46,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An independent device manufacturer, we work with our 100,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the Internet of Things and 5G technology. Further information can be found at www.st.com.
Alissa M. Fitzgerald, Ph.D. is the CEO of A.M. Fitzgerald & Associates, LLC, which she founded in 2003. She has over 25 years of engineering experience in MEMS design, fabrication and product development. Having developed more than a dozen distinct MEMS devices, she now advises clients on the entire cycle of microelectronic product development, from business and IP strategy to supply chain and manufacturing operations. Prior to founding AMFitzgerald, Dr. Fitzgerald worked in engineering positions at the Jet Propulsion Laboratory, Orbital Sciences Corporation, Sigpro, and Sensant Corporation, now part of Siemens. She received her bachelor’s and master’s degrees from MIT and her Ph.D. from Stanford University in Aeronautics and Astronautics. Dr. Fitzgerald has numerous journal publications, holds nine patents, and is an author of the textbook “MEMS Product Development.” She is a member of the SEMI-MSIG standards committee and served as a board director on the MEMS Industry Group (MIG) Governing Council from 2008-2014. In 2013, she was inducted into the MIG Hall of Fame. She is currently a board director of Rigetti Computing and of the Transducer Research Foundation.
Having completed several hundred MEMS product development projects for clients, the two most common reasons for commercialization delay or failure to reach market are inadequate funding and underestimating manufacturing unit cost. This webinar will discuss how to estimate the funding needed for a new MEMS product development. It will also show how to estimate the recurring unit cost of a MEMS device in order to validate a company’s business model. Securing enough funding to complete the product development and making sure that the MEMS product will be able to generate enough profit to drive a company’s business model are two crucial factors which are as important to a company’s success as the technology itself.
A.M. Fitzgerald & Associates, LLC (“AMFitzgerald”) provides complete solutions for MEMS product development. Our full service engineering capabilities include: custom MEMS design to specification, semi-custom RocketMEMS® pressure sensors, process integration, prototype and short-run fabrication, multiphysics finite element modeling, foundry selection and transfer with support through production, and technology strategy consulting.
VP and Head of Product Area MEMS – Bosch Sensortec GmbH
Ralf Schellin received his PhD degree in Electrical Engineering and his Master degree in Technical Physics at the Technical University of Darmstadt, Germany. Currently he is based in Reutlingen, Germany, where he is Head of the Product Area MEMS of Bosch Sensortec. Prior to this, he was Director of Product Management of Bosch Sensortec. From 2010 to 2014 he was leading a cross divisional project at Bosch on Tiny Wireless Sensors for the Internet of Things. From 2007 to 2009 he was leading an engineering group at Bosch Sensortec. Between 2001 and 2006 he held various positions in engineering and product management at Siemens in Munich, Germany, in the area of mobile devices based on IP technologies. Between 1996 and 2000 he was leading various projects in the automotive area of Bosch in Reutlingen working on safety relevant MEMS based sensors. Prior to Bosch he was holding a post-doc position in biosensors at University of Twente, Enschede, The Netherlands.
MEMS sensors are playing a key role as the silent enablers of today’s and future consumer electronics applications. With the growing relevance of social trends like safety, health and personalization, the complexity of daily life use cases is increasing. To tackle the resulting challenges, new approaches are required in the MEMS sensors industry. To continue providing additional value to the customers, a stronger focus on hardware-software co-design is required by using advanced algorithms and embedded AI.
In his presentation, Dr Ralf Schellin, Vice President and Head of Product Area MEMS at Bosch Sensortech, will illustrate the ‘silent’ role of advanced algorithms, MEMS sensors and embedded AI by providing specific use case examples in the context of environmental sensing and self-learning.
Bosch Sensortec GmbH, a fully owned subsidiary of Robert Bosch GmbH, develops and markets a wide portfolio of microelectromechanical systems (MEMS) sensors and solutions tailored for smartphones, tablets, wearables and hearables, AR/VR devices, drones, robots, smart home and IoT (Internet of Things) applications. The product portfolio includes 3-axis accelerometers, gyroscopes and magnetometers, integrated 6- and 9-axis sensors, smart sensors, barometric pressure sensors, humidity sensors, gas sensors, optical microsystems and comprehensive software. Since its foundation in 2005, Bosch Sensortec has emerged as the MEMS technology leader in the markets it addresses. Bosch has been both a pioneer and a global market leader in the MEMS sensor segment since 1995 and has, to date, sold more than 10 billion MEMS sensors.
The Bosch Group is a leading global supplier of technology and services. It employs roughly 394,500 associates worldwide (as of December 31, 2020). According to preliminary figures, the company generated sales of 71.6 billion euros in 2020. Its operations are divided into four business sectors: Mobility Solutions, Industrial Technology, Consumer Goods, and Energy and Building Technology. As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 440 subsidiary and regional companies in 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. The basis for the company’s future growth is its innovative strength. At 126 locations across the globe, Bosch employs some 73,000 associates in research and development, as well as roughly 30,000 software engineers.
Sales Director – scia Systems GmbH
Marcel Demmler graduated in Physical Engineering in 2007. After his graduation, he had a position in the R&D team in a company specified in ion beam and plasma process technologies. In 2011 he started working as a Sales Director for the US and Japanese markets in that company. Marcel Demmler joined scia Systems as Sales Director right from the beginning in 2013
Ion Beam Etching with inert gases allows the removal or structuring of nearly any material, incl. noble metals like Au or Pt, or composite materials like AlScN or PZT. In contrast to RIE processes, similar etching recipes are used for all materials because of the physical nature. Hence, structuring of multi-material stacks as commonly applied for magnetic sensors (TMR / GMR) and memories (MRAM) can easily be performed. But also reactive gases containing fluorine or chlorine are used for tuning of selectivity’s and improving removal rates. While balancing the chemical and the physical part, etching geometries can be precisely adjusted. This enables for example the manufacturing of slanted structures, which cannot be realized by standard RIE processes. Additionally, the ion beam could be focused down to a size of several millimeter. This allows a local material removal on specific areas on the wafer. Hence non-uniformities in film thickness can be corrected and finally manufacturing yield are improved significantly.
scia Systems is a full range supplier for precise surface processing equipment, based on advanced ion beam and plasma technologies. The systems are applicable for coating, etching and cleaning processes, especially for the MEMS, microelectronics and precision optics industries, in both, high volume production as well as research and development environments.
scia Systems stands for highly reliable equipment to meet expectation for today and the future. Due to their flexible and modular design, the systems can be configured according to customer specific requirements. Amongst others by combining several vacuum process chambers into cluster or in-line solutions. Together with our worldwide service partners, we offer comprehensive service and superior technology support.
- Ion Beam Trimming (IBT)
- Ion Beam Etching and Milling (IBE/IBM)
- Dual Ion Beam Sputtering (DIBS)
- Plasma Enhanced Chemical Vapor Deposition (PECVD)
- Reactive Ion Etching (RIE)
- Magnetron Sputtering
- Dry Cleaning
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